RF360 Holdings is a Qualcomm and TDK Joint Venture driving innovation in Radio Frequency Front End (RFFE). With over 4,000 employees worldwide, RF360 Holdings develops and manufactures innovative RFFE filtering solutions for mobile devices and fast growing business segments, such as IoT, drones, robotics, automotive applications and more.

RF360 Holdings offers a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe.

Qualcomm RF360 front-end solution includes a comprehensive family of chips—power amplifier, power trackers, antenna tuners, RF switches, diversity receive modules, integrated and discrete filters, multiplexers, and extractors.

Designed to support global and regional LTE Advanced carrier aggregation band combinations, Qualcomm RF360 provides a comprehensive, system-level RF front-end solution. Qualcomm RF360 is designed to work together with the modem and RF transceiver to allow manufacturers the flexibility to design thinner, battery-friendly LTE and LTE Advanced mobile devices that deliver higher performance using less power.